Pad Cell Generator: Difference between revisions
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The LibreSilicon Pad Cell Generator is an extension of the Standard Logic Cell Library generator, which besides the driver logic also dynamically generates the mixed signal parts needed for over current and static discharge protection and providing the currents needed for doing useful things with an actual physical chip, like driving an LED or a small motor. | The LibreSilicon Pad Cell Generator is an extension of the [[StdCellLib|Standard Logic Cell Library generator]], which besides the driver logic also dynamically generates the mixed signal parts needed for over current and static discharge protection and providing the currents needed for doing useful things with an actual physical chip, like driving an LED or a small motor. | ||
A typical pad cell consists of driver logic, ESD protection and a bonding pad, which essentially just is a "large" metal square, big enough to fit a bonding ball needed to attach the bonding wire or solder it to a PCB (flip chip bonding) or onto another carrier substrate chip (chiplet assembly)[[File:Padcell.png|thumb|Pad Cell in Magic editor]] | A typical pad cell consists of driver logic, ESD protection and a bonding pad, which essentially just is a "large" metal square, big enough to fit a bonding ball needed to attach the bonding wire or solder it to a PCB (flip chip bonding) or onto another carrier substrate chip (chiplet assembly)[[File:Padcell.png|thumb|Pad Cell in Magic editor]] | ||
Revision as of 10:18, 30 November 2024
The LibreSilicon Pad Cell Generator is an extension of the Standard Logic Cell Library generator, which besides the driver logic also dynamically generates the mixed signal parts needed for over current and static discharge protection and providing the currents needed for doing useful things with an actual physical chip, like driving an LED or a small motor.
A typical pad cell consists of driver logic, ESD protection and a bonding pad, which essentially just is a "large" metal square, big enough to fit a bonding ball needed to attach the bonding wire or solder it to a PCB (flip chip bonding) or onto another carrier substrate chip (chiplet assembly)
Driver Logic
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Driver circuit
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ESD protection
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