Roadmap: Difference between revisions

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(Created page with "== Our roadmap == As of 2021, our tentative roadmap is the following: * Establishment of LibreSilicon Foundation in Europe * Finish LS1U technology node (incl. SPICE parameter extraction) * Development of ESD protection and pad cell library for LS1U * Development of a maskless lithography stepper, initially at least for 50um MFS, later for LS1U * Tech Demo: LS555 (design, MLL fabrication, testing) * Digital cell library for 1u MFS + digital tool...")
 
 
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As of 2021, our tentative roadmap is the following:
As of 2021, our tentative roadmap is the following:


    * Establishment of LibreSilicon Foundation in Europe
* Establishment of LibreSilicon Foundation in Europe
    * Finish LS1U technology node (incl. SPICE parameter extraction)
* Finish LS1U technology node (incl. SPICE parameter extraction)
    * Development of ESD protection and pad cell library for LS1U
* Development of ESD protection and pad cell library for LS1U
    * Development of a maskless lithography stepper, initially at least for 50um MFS, later for LS1U
* Development of a maskless lithography stepper, initially at least for 50um MFS, later for LS1U
    * Tech Demo: LS555 (design, MLL fabrication, testing)
* Tech Demo: LS555 (design, MLL fabrication, testing)
    * Digital cell library for 1u MFS + digital tools (may be parallel to LS1U/LS555)
* Digital cell library for 1u MFS + digital tools (may be parallel to LS1U/LS555)
    * Tech demo II: 8-bit Arduino-compatible MCU
* Tech demo II: 8-bit Arduino-compatible MCU
    * later ...
* later ...
    * Libresilicon Fabrication Service opens in EU
* Libresilicon Fabrication Service opens in EU
    * later ...
* later ...
    * Development of LS130 technology node (incl. MLL capablity)
* Development of LS130 technology node (incl. MLL capablity)
    * Tech demo III: 130nm System-on-Chip
* Tech demo III: 130nm System-on-Chip
    * ...
* ...
    * Development of sub-100nm technology node (incl. MLL capablity)
* Development of sub-100nm technology node (incl. MLL capablity)
    * Tech demo IV: SOC made on LibreSilicon runs GNU/Linux
* Tech demo IV: SOC made on LibreSilicon runs GNU/Linux

Latest revision as of 18:32, 26 May 2024

Our roadmap

As of 2021, our tentative roadmap is the following:

  • Establishment of LibreSilicon Foundation in Europe
  • Finish LS1U technology node (incl. SPICE parameter extraction)
  • Development of ESD protection and pad cell library for LS1U
  • Development of a maskless lithography stepper, initially at least for 50um MFS, later for LS1U
  • Tech Demo: LS555 (design, MLL fabrication, testing)
  • Digital cell library for 1u MFS + digital tools (may be parallel to LS1U/LS555)
  • Tech demo II: 8-bit Arduino-compatible MCU
  • later ...
  • Libresilicon Fabrication Service opens in EU
  • later ...
  • Development of LS130 technology node (incl. MLL capablity)
  • Tech demo III: 130nm System-on-Chip
  • ...
  • Development of sub-100nm technology node (incl. MLL capablity)
  • Tech demo IV: SOC made on LibreSilicon runs GNU/Linux